We deliver precision PCB assembly and harness integration services engineered for the critical demands of aerospace and space applications. Our solutions are built to withstand the harshest environmental conditions—ensuring reliable performance from launchpad to orbit.
We specialize in assembling high-density, high-reliability PCBs using both surface-mount and through-hole technologies, aligned with IPC Class 3 and ECSS/NASA standards. Our experienced team ensures every circuit and connection meets exacting specifications through rigorous inspection, testing, and traceability protocols.
In parallel, our space-grade wire harness integration services support custom interconnect solutions with robust shielding, routing, and strain relief—delivering clean, organized, and EMI-safe assemblies for complex aerospace systems.
Our Expertise Includes:
Surface Mount (SMT) & Through-Hole PCB Assembly
Mixed-technology & multi-layer board handling
Aerospace-grade wire & cable harness fabrication
ESD-safe assembly and cleanroom handling
Automated Optical Inspection (AOI), X-ray, and functional testing
Full documentation & compliance with ECSS, NASA, and MIL-STD requirements
At Avenir Technologies, we turn complex designs into flight-ready hardware, combining craftsmanship, compliance, and quality to support your mission’s success.
Surface Mount (SMT) & Through-Hole PCB Assembly
We offer high-reliability Surface Mount (SMT) and Through-Hole PCB Assembly services engineered to meet the strict standards of aerospace, defense, and space missions.
Our team is skilled in handling complex, multi-layer PCBs using both automated and precision manual assembly processes. Every board is built under IPC Class 3 and space-grade guidelines, ensuring exceptional durability, accuracy, and performance in the most demanding operational environments—including launch vibrations, thermal extremes, and vacuum conditions.
Whether you require high-density SMT assemblies for compact avionics or robust through-hole soldering for mission-critical power systems, we provide full lifecycle support—from prototyping to production.
Key Capabilities:
Fine-pitch SMT placement & BGA rework
Single, double-sided & multi-layer PCB assembly
Mixed-technology (SMT + Through-Hole) integration
Leaded and lead-free soldering per customer specs
Automated Optical Inspection (AOI), X-ray & functional testing
Traceability, conformal coating & environmental compliance
Mixed-technology & multi-layer board handling
We specialize in mixed-technology and multi-layer PCB handling for aerospace and space-grade applications, where reliability and performance are non-negotiable.
Our expert team is equipped to assemble and inspect complex circuit boards that combine Surface Mount Technology (SMT) and Through-Hole Technology (THT) on single or double sides—often across multi-layer configurations with high component density. These assemblies are designed to operate under extreme conditions such as vibration, radiation, and wide temperature fluctuations encountered in aerospace missions.
We follow strict IPC Class 3 and ECSS/NASA standards, ensuring that every layer, via, and joint meets the highest levels of quality, durability, and traceability. Whether for satellite systems, avionics, or space communication equipment, our advanced processes support both prototype and flight-ready production.
Our Capabilities Include:
Assembly of boards with 4 to 18+ layers
Mixed SMT and Through-Hole component placement
Rigid, flexible, and rigid-flex board support
Thermal and impedance-sensitive layout handling
Advanced inspection: AOI, X-ray, and electrical testing
Cleanroom-compatible handling and ESD-safe workstations
Aerospace-Grade Wire & Cable Harness Fabrication
We provide precision-engineered aerospace-grade wire and cable harness fabrication designed for reliability in the most demanding mission environments—from launch vehicles and satellites to avionics and defense systems.
Our harnesses are built using space-qualified materials, including low-outgassing wires, heat-shrink tubing, EMI shielding, and radiation-resistant insulation. Every assembly is custom-designed and fabricated to ensure flawless electrical performance, mechanical strength, and environmental resilience under harsh operating conditions.
We adhere to international aerospace standards such as IPC/WHMA-A-620, ECSS-Q-ST, and NASA-STD-8739, and our technicians are trained in certified soldering, crimping, and routing techniques to support both flight and ground systems.
Our Harness Fabrication Services Include:
Custom harness design, layout & prototyping
Shielded, twisted-pair & multi-core cable assemblies
Connector termination (MIL-spec, D-sub, circular, etc.)
Strain relief, sleeving, and labeling per aerospace standards
100% electrical testing (continuity, insulation resistance)
Cleanroom handling, ESD-safe assembly, and full traceability
ESD-safe assembly and cleanroom handling
We understand that even the smallest contaminants or static charges can jeopardize the success of aerospace systems. That’s why we maintain strict ESD-safe assembly protocols and certified cleanroom handling environments to ensure the integrity, reliability, and longevity of your mission-critical hardware.
Our workspaces are equipped with advanced Electrostatic Discharge (ESD) control systems, including grounded workstations, ESD-safe tools, and continuous personnel monitoring. This ensures full protection of sensitive components such as satellite electronics, flight-grade PCBs, and payload systems throughout the assembly and integration process.
Additionally, our ISO-certified cleanroom environments provide particle-controlled conditions essential for assembling optical systems, avionics, and other contamination-sensitive equipment. Every product is handled, inspected, and packaged with precision, maintaining full compliance with ECSS, IPC, and NASA cleanliness standards.
Key Features:
EPA-compliant ESD-safe assembly zones
ISO Class 7 & Class 8 cleanroom facilities
Cleanroom gowning, controlled airflow, and HEPA filtration
Anti-static storage, transport, and packaging materials
Personnel trained in ESD & contamination control best practices
Full traceability and quality documentation
Automated Optical Inspection (AOI), X-ray, and functional testing
We ensure that every aerospace assembly we produce meets the highest standards of quality, reliability, and compliance through a comprehensive suite of inspection and testing processes—including Automated Optical Inspection (AOI), X-ray analysis, and Functional Testing.
Our AOI systems use advanced imaging and pattern recognition to detect surface defects, solder joint issues, and component placement errors on complex PCB assemblies. For multilayer and densely populated boards, X-ray inspection allows us to verify internal features such as BGA connections, hidden joints, and via integrity—ensuring defects are identified and corrected before integration.
To validate operational performance, we conduct Functional Testing under simulated real-world conditions, verifying electrical characteristics, system behavior, and software/hardware interfacing. Each unit is tested to meet or exceed IPC Class 3, ECSS, NASA, and MIL-STD standards.
Testing Capabilities Include:
3D AOI for SMT and Through-Hole PCB inspection
High-resolution X-ray inspection for hidden defects and voids
Functional testing for analog, digital, and mixed-signal systems
In-Circuit Testing (ICT) and Boundary Scan support
Customized test fixtures and simulation environments
Comprehensive test reporting and traceability
Full documentation & compliance with ECSS, NASA, and MIL-STD requirements
We recognize that technical excellence must be matched by regulatory compliance and precise documentation—especially in the aerospace and defense industries. That’s why we provide end-to-end documentation and standards compliance aligned with ECSS (European Cooperation for Space Standardization), NASA, and MIL-STD requirements.
Our dedicated engineering and quality teams ensure that every component, process, and product is fully documented and traceable—from raw material certification to final acceptance testing. We support clients throughout project lifecycles with structured documentation packages that meet both agency and customer-specific guidelines.
Whether you’re preparing for a Preliminary Design Review (PDR), Critical Design Review (CDR), or Flight Readiness Review (FRR), Avenir Technologies delivers complete, audit-ready documentation to ensure full mission assurance and traceability.
Our Documentation & Compliance Services Include:
Full ECSS/NASA-compliant documentation packages (DDP, DRD, PMP)
Manufacturing & test travelers, work instructions, and inspection records
Part, Material & Process (PMP) qualification documentation
Acceptance Test Procedures (ATP) & Reports (ATR)
Configuration Management and version control
Compliance support for IPC Class 3, MIL-STD-883, MIL-STD-810, and more
