We provide specialized electronic manufacturing services for BTP (Box-Type Payloads) and STS (Subsystems and Test Sets)—critical components in aerospace and satellite systems where precision, reliability, and compliance are non-negotiable.
Our team is skilled in high-reliability electronic assembly, integrating complex PCB systems, connectors, wiring, and shielding to build robust enclosures and test systems that perform flawlessly in the harshest conditions—on the ground and in orbit. Every BTP and STS unit we deliver is engineered and manufactured in compliance with aerospace standards including ECSS, MIL-STD, and IPC Class 3, and is fully traceable and documented.
From prototyping and qualification models to flight-ready units, our processes ensure tight quality control, functional validation, and environmental testing at every stage.
Our BTP / STS Capabilities Include:
Design support & manufacturability consultation
PCB assembly & harness integration
Enclosure design, EMI shielding & thermal management
Custom Test Set (STS) fabrication for ground testing
Functional & environmental qualification (TVAC, Vibration, ESS)
Full documentation & compliance support (ECSS/NASA/MIL-STD)
With Avenir Technologies as your manufacturing partner, your BTP and STS systems are built with space-grade precision, ground-tested performance, and mission-assured reliability.
Design Support & Manufacturability Consultation
we go beyond manufacturing—we become your engineering partner. Our Design Support and Manufacturability Consultation services are tailored to help aerospace clients optimize their systems for performance, reliability, and production efficiency.
From concept to launch readiness, our team collaborates closely with your engineers to evaluate every aspect of your design—from component selection and layout to thermal management and structural integrity. We apply deep knowledge of space-grade standards (ECSS, NASA, MIL-STD) and production best practices to ensure your design is not only innovative but also manufacturable, testable, and compliant.
Our goal is to reduce design iterations, avoid costly late-stage revisions, and streamline your path to mission success.
Our Services Include:
Design for Manufacturability (DFM) & Design for Test (DFT) reviews
Material, component, and process selection guidance
3D modeling & mechanical packaging consultation
Thermal, structural, and EMI/EMC design input
Risk identification & mitigation strategies
Compliance alignment with ECSS/NASA/IPC Class 3 standards
By engaging Avenir Technologies early in the design cycle, you gain access to a team that ensures your vision is engineered for flight and optimized for production—from the first sketch to final launch.
PCB assembly & harness integration
We specialize in high-reliability PCB assembly and harness integration tailored to meet the exacting demands of the aerospace and space sectors. Our expertise lies in assembling mission-critical electronics that deliver consistent performance in extreme environments—from launch vibration to deep-space vacuum.
Our facilities are equipped for IPC Class 3 and space-grade assembly standards, ensuring that every printed circuit board and wiring harness is built with precision, tested for durability, and fully traceable. We support projects across satellite systems, avionics, payload interfaces, and custom aerospace subsystems.
With full traceability, advanced inspection processes, and cleanroom handling where required, we help our clients meet ECSS, NASA, and MIL-STD requirements with confidence.
Capabilities Include:
Surface Mount (SMT) and Through-Hole PCB Assembly
Mixed-technology & double-sided board assembly
Aerospace-grade wire harness fabrication & routing
Conformal coating, encapsulation & thermal management
Automated Optical Inspection (AOI) & X-ray analysis
Functional & continuity testing with complete documentation
Whether you’re developing flight hardware or ground support electronics, Avenir Technologies delivers PCB and harness solutions that are precise, rugged, and space-proven.
